发明授权
- 专利标题: Fluid ejector having an anisotropic surface chamber etch
- 专利标题(中): 具有各向异性表面腔蚀刻的流体喷射器
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申请号: US10911186申请日: 2004-08-04
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公开(公告)号: US07213908B2公开(公告)日: 2007-05-08
- 发明人: James M. Chwalek , John A. Lebens , Christopher N. Delametter , David P. Trauernicht , Gary A. Kneezel
- 申请人: James M. Chwalek , John A. Lebens , Christopher N. Delametter , David P. Trauernicht , Gary A. Kneezel
- 申请人地址: US NY Rochester
- 专利权人: Eastman Kodak Company
- 当前专利权人: Eastman Kodak Company
- 当前专利权人地址: US NY Rochester
- 代理商 William R. Zimmerli
- 主分类号: B41J2/05
- IPC分类号: B41J2/05
摘要:
A fluid ejecting device and method of forming same are provided. The fluid ejecting device includes a substrate having a first surface and a second surface located opposite the first surface. A nozzle plate is formed over the first surface of the substrate. The nozzle plate has a nozzle through which fluid is ejected. A drop forming mechanism is situated at the periphery of the nozzle. A fluid chamber is in fluid communication with the nozzle and has a first wall and a second wall with the first wall and the second wall being positioned at an angle relative to each other. A fluid delivery channel is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber. A source of fluid impedance includes a physical structure located between the nozzle and the fluid delivery channel.
公开/授权文献
- US20060028511A1 Fluid ejector having an anisotropic surface chamber etch 公开/授权日:2006-02-09
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