发明授权
- 专利标题: Pressure sensor with silicon frit bonded cap
- 专利标题(中): 带硅玻璃料的压力传感器
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申请号: US11328415申请日: 2006-01-06
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公开(公告)号: US07216547B1公开(公告)日: 2007-05-15
- 发明人: Carl E. Stewart , Gilberto Morales
- 申请人: Carl E. Stewart , Gilberto Morales
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 代理商 Kermit D. Lopez; Luis M. Ortiz
- 主分类号: G01L7/00
- IPC分类号: G01L7/00
摘要:
A pressure sensor apparatus and method that incorporates a silicon frit bonded cap. The pressure sensor includes a silicon sensor wafer with diaphragms at a bottom surface thereof, a silicon cap wafer mounted on the topside of each sensor wafer, a plurality of silicon sensor die formed on the sensor wafer, a silicon cap wafer etched to create a plurality of reference cavities on the topside of the diaphragm, a thin glass frit to form a wafer-to-wafer bond between the sensor wafer and cap wafer. Sensing devices such as semiconductor die/sensor, peizoresistors, can be used to sense the pressure. The wafer-to-wafer frit bonding improves the output signal drift and the thermal performance of the pressure sensor minimizes the thermal mismatch created by anodic bonded glass wafers.