发明授权
- 专利标题： Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method
- 专利标题（中）： 使用制造方法制造的具有用于高温耐热性的载体箔的电解铜箔和具有用于高温耐热性的载体箔的电沉积铜箔的方法
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申请号： US10483612申请日： 2003-05-12
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公开(公告)号： US07217464B2公开(公告)日： 2007-05-15
- 发明人: Akitoshi Takanashi , Kenichiro Iwakiri , Akiko Sugimoto , Junshi Yoshioka , Shinichi Obata , Makoto Dobashi
- 申请人： Akitoshi Takanashi , Kenichiro Iwakiri , Akiko Sugimoto , Junshi Yoshioka , Shinichi Obata , Makoto Dobashi
- 申请人地址： JP Shinagawa-ku, Tokyo
- 专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人地址： JP Shinagawa-ku, Tokyo
- 代理机构： Rothwell, Figg, Ernst & Manbeck PC
- 优先权： JP2002-138881 20020514
- 国际申请： PCT/JP03/05892 WO 20030512
- 国际公布： WO03/095714 WO 20031120
- 主分类号： B32B15/04
- IPC分类号： B32B15/04 ; B32B15/20 ; B05D1/18 ; B05D3/10 ; C23G1/02
摘要：
The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose are adopted “a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed” and others.