发明授权
- 专利标题: Thin wafer insert
- 专利标题(中): 薄晶片插入
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申请号: US10478587申请日: 2002-03-28
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公开(公告)号: US07219802B2公开(公告)日: 2007-05-22
- 发明人: Brian Wiseman , Michael Peterson , Tony Simpson
- 申请人: Brian Wiseman , Michael Peterson , Tony Simpson
- 申请人地址: US MN Chaska
- 专利权人: Entegris, Inc.
- 当前专利权人: Entegris, Inc.
- 当前专利权人地址: US MN Chaska
- 代理机构: Patterson, Thunete, Skaar & Christensen, P.A.
- 国际申请: PCT/US02/09423 WO 20020328
- 国际公布: WO02/079053 WO 20021010
- 主分类号: B65D85/00
- IPC分类号: B65D85/00
摘要:
A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods of supporting the thin wafers as provided by the insert and the wafer carrier. The insert (20), in preferred embodiments, utilize tabs (80, 82) that fit into the side wall recesses (53) and have an interference fit in said recesses to secure the insert in place.
公开/授权文献
- US20040188320A1 Thin wafer insert 公开/授权日:2004-09-30
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