Thin wafer insert
    1.
    发明授权
    Thin wafer insert 有权
    薄晶片插入

    公开(公告)号:US07219802B2

    公开(公告)日:2007-05-22

    申请号:US10478587

    申请日:2002-03-28

    IPC分类号: B65D85/00

    摘要: A plastic insert (20) is configured to provide support of thin wafers (49) in wafer carriers (45) configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the, methods of supporting the thin wafers as provided by the insert and the wafer carrier. The insert (20), in preferred embodiments, utilize tabs (80, 82) that fit into the side wall recesses (53) and have an interference fit in said recesses to secure the insert in place.

    摘要翻译: 塑料插入件(20)被配置成在晶片载体(45)中提供薄晶片(49)的支撑,晶片载体(45)被配置为提供外围晶片支撑。 本发明包括插入件,与晶片载体组合的插入件,以及由插入件和晶片载体提供的支撑薄晶片的方法。 在优选实施例中,插入件(20)利用装配到侧壁凹槽(53)中的突片(80,82),并且在所述凹槽中具有过盈配合以将插入件固定就位。