发明授权
- 专利标题: Method for fabricating semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US10882357申请日: 2004-07-02
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公开(公告)号: US07220638B2公开(公告)日: 2007-05-22
- 发明人: Kouichi Tani , Osamu Yamaguchi
- 申请人: Kouichi Tani , Osamu Yamaguchi
- 申请人地址: JP Tokyo
- 专利权人: Oki Electric Industry Co., Ltd.
- 当前专利权人: Oki Electric Industry Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Rabin & Berdo, PC
- 优先权: JP2003-198333 20030717
- 主分类号: H01L21/8238
- IPC分类号: H01L21/8238
摘要:
A method for fabricating a semiconductor device in which plural transistors including a first transistor and a second transistor are integrated includes a first step for forming the first transistor such that a distance between a drain contact and a gate electrode of the first transistor is a first distance, and a second step for forming the second transistor such that a distance between a drain contact and a gate electrode of the second transistor is a second distance larger than the first distance.
公开/授权文献
- US20050014339A1 Method for fabricating semiconductor device 公开/授权日:2005-01-20
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