发明授权
- 专利标题： Conductive resin composition and process for producing the same
- 专利标题（中）： 导电树脂组合物及其制造方法
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申请号： US10240793申请日： 2001-02-26
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公开(公告)号： US07220795B2公开(公告)日： 2007-05-22
- 发明人: Takaaki Miyoshi , Kazuhiko Hashimoto
- 申请人： Takaaki Miyoshi , Kazuhiko Hashimoto
- 申请人地址： JP Osaka
- 专利权人： Asahi Kasei Kabushiki Kaisha
- 当前专利权人： Asahi Kasei Kabushiki Kaisha
- 当前专利权人地址： JP Osaka
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2000-125081 20000426
- 国际申请： PCT/JP01/01416 WO 20010226
- 国际公布： WO01/81473 WO 20011101
- 主分类号： C08L77/00
- IPC分类号： C08L77/00 ; C08L77/12 ; C08K3/00 ; C08K13/08
摘要：
A resin composition comprising a polyamide, a polyphenylene ether, an impact modifier, and a carbon type filler for an electrically conductive use, the filler residing in a phase of the polyphenylene ether. The resin composition of the present invention has excellent electrical conductivity, fluidity, and an excellent balance of a coefficient of linear expansion and an impact resistance, and generation of fines caused by pelletizing thereof can be largely suppressed when processing of an extrusion thereof is conducted.
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