发明授权
- 专利标题: Semiconductor memory chip
- 专利标题(中): 半导体存储芯片
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申请号: US11242150申请日: 2005-10-04
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公开(公告)号: US07221615B2公开(公告)日: 2007-05-22
- 发明人: Paul Wallner , Martin Streibl , Manfred Menke , Yukio Fukuzo , Christian Sichert , Peter Gregorius
- 申请人: Paul Wallner , Martin Streibl , Manfred Menke , Yukio Fukuzo , Christian Sichert , Peter Gregorius
- 申请人地址: DE Munich
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Munich
- 代理机构: Edell, Shapiro & Finnan, LLC
- 主分类号: G11C7/00
- IPC分类号: G11C7/00 ; G11C8/00
摘要:
A semiconductor memory chip includes: a reception interface section for receiving external data, command, and address signals in form of serial signal frames; an intermediate data buffer for intermediately storing write data and, optionally, write data mask bits to be written to a memory cell array; a memory core having a bank organized memory cell array; a decoder section for decoding an address derived from a signal frame received from the reception interface section for writing/reading data in/from one or more memory banks of the memory cell array in accordance with a write/read command within one or more received signal frames; and a frame decoder provided as an interface between the reception interface section and the memory core for decoding one or more commands included in one or more frames and outputting data addresses, command, and read/write access indication signals to the memory core and to the intermediate data buffer.
公开/授权文献
- US20070076508A1 SEMICONDUCTOR MEMORY CHIP 公开/授权日:2007-04-05
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