Invention Grant
- Patent Title: Test output compaction using response shaper
- Patent Title (中): 使用响应整形器测试输出压缩
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Application No.: US10985599Application Date: 2004-11-10
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Publication No.: US07222277B2Publication Date: 2007-05-22
- Inventor: Seongmoon Wang , Srimat T. Chakradhar , Chia-Tso Chao
- Applicant: Seongmoon Wang , Srimat T. Chakradhar , Chia-Tso Chao
- Applicant Address: US NJ Princeton
- Assignee: NEC Laboratories America, Inc.
- Current Assignee: NEC Laboratories America, Inc.
- Current Assignee Address: US NJ Princeton
- Main IPC: G01R31/28
- IPC: G01R31/28
Abstract:
A test output compaction architecture and method that takes advantage of a response shaper in order to minimize masking of faults during compaction. A response shaper is inserted between a plurality of scan chains and an output compactor. The response shaper receives output responses from scan chains and reshapes the output responses in a manner that minimizes masking of faults by the output compactor.
Public/Granted literature
- US20060101316A1 Test output compaction using response shaper Public/Granted day:2006-05-11
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