Invention Grant
- Patent Title: Multi-level thin film capacitor on a ceramic substrate
- Patent Title (中): 陶瓷基板上的多层薄膜电容器
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Application No.: US10997344Application Date: 2004-11-24
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Publication No.: US07224040B2Publication Date: 2007-05-29
- Inventor: Ivoyl P. Koutsaroff , Mark Vandermeulen , Andrew Cervin-Lawry , Atin J. Patel
- Applicant: Ivoyl P. Koutsaroff , Mark Vandermeulen , Andrew Cervin-Lawry , Atin J. Patel
- Applicant Address: CA
- Assignee: Gennum Corporation
- Current Assignee: Gennum Corporation
- Current Assignee Address: CA
- Agency: Jones Day
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).
Public/Granted literature
- US20050117272A1 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same Public/Granted day:2005-06-02
Information query
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