发明授权
US07225754B2 Plasma processing apparatus including a plurality of plasma processing units having reduced variation
有权
等离子体处理装置包括具有减小的变化的多个等离子体处理单元
- 专利标题: Plasma processing apparatus including a plurality of plasma processing units having reduced variation
- 专利标题(中): 等离子体处理装置包括具有减小的变化的多个等离子体处理单元
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申请号: US10811034申请日: 2004-08-27
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公开(公告)号: US07225754B2公开(公告)日: 2007-06-05
- 发明人: Akira Nakano , Tadahiro Ohmi
- 申请人: Akira Nakano , Tadahiro Ohmi
- 申请人地址: JP Tokyo
- 专利权人: ALPS Electric Co., Ltd.
- 当前专利权人: ALPS Electric Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Brinks Hofer Gilson & Lione
- 优先权: JP2000-341076 20001108
- 主分类号: C23C16/00
- IPC分类号: C23C16/00
摘要:
A plasma processing apparatus comprising a plurality of plasma processing units is provided. Each of the plasma processing units has a matching circuit connected between a radiofrequency generator and a plasma excitation electrode. Among these plasma processing units, a variation between the maximum and minimum values of input-terminal-side AC resistances RA of the matching circuits defined by =(RAmax−RAmin)/(RAmax+RAmin) is adjusted to be less than 0.5. A variation between the maximum and minimum values of output-terminal-side AC resistances RB of the matching circuits defined by =(RBmax−RBmin)/(RBmax+RBmin) is also adjusted to be less than 0.5. The plasma processing units can be adjusted to achieve substantially uniform plasma results in a shorter period of time.