Invention Grant
- Patent Title: Electronic device carrier and manufacture tape
- Patent Title (中): 电子设备载体和制造胶带
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Application No.: US10916746Application Date: 2004-08-11
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Publication No.: US07228622B2Publication Date: 2007-06-12
- Inventor: Jeffrey Watson
- Applicant: Jeffrey Watson
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01R11/00
- IPC: H01R11/00

Abstract:
A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.
Public/Granted literature
- US20050016898A1 Electronic package carrier tape Public/Granted day:2005-01-27
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