Invention Grant
- Patent Title: Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
- Patent Title (中): 抛光垫，压板，监测方法，制造方法和检测方法
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Application No.: US10726637Application Date: 2003-12-04
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Publication No.: US07229337B2Publication Date: 2007-06-12
- Inventor: Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
- Applicant: Young-Sam Lim , Dong-Jun Lee , Nam-Soo Kim , Sung-Taek Moon , Kyoung-Moon Kang , Jae-Hyun So
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2003-0038740 20030616
- Main IPC: B24B19/00
- IPC: B24B19/00
Abstract:
A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.
Public/Granted literature
- US20040253910A1 Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting Public/Granted day:2004-12-16
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