Invention Grant
- Patent Title: Synchronized communication between integrated circuit chips
- Patent Title (中): 集成电路芯片之间的同步通信
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Application No.: US10702042Application Date: 2003-11-06
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Publication No.: US07231538B2Publication Date: 2007-06-12
- Inventor: Jean-Paul Clavequin , Pascal Couteaux , Philippe Diehl
- Applicant: Jean-Paul Clavequin , Pascal Couteaux , Philippe Diehl
- Applicant Address: US OR Wilsonville
- Assignee: Mentor Graphics (Holdings) Ltd.
- Current Assignee: Mentor Graphics (Holdings) Ltd.
- Current Assignee Address: US OR Wilsonville
- Agency: Banner & Witcoff, Ltd.
- Main IPC: G06F1/12
- IPC: G06F1/12 ; G06F13/42
Abstract:
In emulation systems having a plurality of chips, data communicated between the chips needs to be synchronized. A receiver chip may push or pull on incoming data from an emitter chip in order to synchronize it with a receiver clock. Unexpected latency on the link between the emitter and receiver chips may also be adjusted for.
Public/Granted literature
- US20050102545A1 Synchronized communication between integrated circuit chips Public/Granted day:2005-05-12
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