Invention Grant
US07231560B2 Apparatus and method for testing motherboard having PCI express devices
有权
用于测试具有PCI Express设备的主板的装置和方法
- Patent Title: Apparatus and method for testing motherboard having PCI express devices
- Patent Title (中): 用于测试具有PCI Express设备的主板的装置和方法
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Application No.: US10985461Application Date: 2004-11-10
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Publication No.: US07231560B2Publication Date: 2007-06-12
- Inventor: Jiin Lai , Wayne Tseng
- Applicant: Jiin Lai , Wayne Tseng
- Applicant Address: TW Taipei
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW Taipei
- Agency: Kirkpatrick & Lockhart Preston Gates Ellis
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G06F11/00
Abstract:
This invention discloses a method for testing at least one physical link on a motherboard associated with an on-board PCI Express device. A test card is connected to an input/output port on the motherboard, wherein the test card has a PCI Express test device. A test pattern is transmitted from the test card to the PCI Express device and receiving a test result pattern by the test card from the PCI Express device through the physical link for testing thereof. The test result pattern is examined to determine defects of the physical link on the motherboard.
Public/Granted literature
- US20050235187A1 Apparatus and method for testing motherboard having PCI express devices Public/Granted day:2005-10-20
Information query
