发明授权
- 专利标题: Body capacitor for SOI memory description
- 专利标题(中): 用于SOI存储器描述的体电容
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申请号: US11064730申请日: 2005-02-24
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公开(公告)号: US07232745B2公开(公告)日: 2007-06-19
- 发明人: Jack A. Mandelman , Louis C. Hsu , Rajiv Vasant Joshi
- 申请人: Jack A. Mandelman , Louis C. Hsu , Rajiv Vasant Joshi
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Rafael Perez-Pineiro, Esq.
- 主分类号: H01L21/3205
- IPC分类号: H01L21/3205 ; H01L21/4763
摘要:
A semiconductor structure having a body capacitance plate, which is formed with a process that assures that the body capacitance plate is self-aligned to both the source line (SL) diffusion and the bitline diffusion is provided. Thus the amount of overlap between the SL and the bitline diffusions and the body capacitance plate is precisely controlled. More specifically, the present invention forms the structure of a 1T-capacitorless SOI body charge storage cell having sidewall capacitor plates using a process that assures that there is 1) minimal overlap between plate and source/drain diffusions, and 2) that the minimal overlap obtained in the present invention is precisely controlled and is not subject to alignment tolerances. The inventive cell results in larger signal margin, improved performance, smaller chip size, and reduced dynamic power dissipation relative to the prior art.
公开/授权文献
- US20060189110A1 Body capacitor for SOI memory description 公开/授权日:2006-08-24
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