发明授权
- 专利标题： System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
- 专利标题（中）： 表面还原，钝化，腐蚀防止和铜表面活化的系统和方法
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申请号： US10769408申请日： 2004-01-30
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公开(公告)号： US07232766B2公开(公告)日： 2007-06-19
- 发明人: Andrew D. Bailey, III , Shrikant P. Lohokare
- 申请人： Andrew D. Bailey, III , Shrikant P. Lohokare
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Martine Penilla & Gencarella, LLP
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
A system and method of passivating an exposed conductive material includes placing a substrate in a process chamber and injecting a hydrogen species into the process chamber. A hydrogen species plasma is formed in the process chamber. A surface layer species is reduced from a top surface of the substrate is reduced. The reduced surface layer species are purged from the process chamber.
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