Invention Grant
- Patent Title: System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
- Patent Title (中): 表面还原，钝化，腐蚀防止和铜表面活化的系统和方法
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Application No.: US10769408Application Date: 2004-01-30
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Publication No.: US07232766B2Publication Date: 2007-06-19
- Inventor: Andrew D. Bailey, III , Shrikant P. Lohokare
- Applicant: Andrew D. Bailey, III , Shrikant P. Lohokare
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A system and method of passivating an exposed conductive material includes placing a substrate in a process chamber and injecting a hydrogen species into the process chamber. A hydrogen species plasma is formed in the process chamber. A surface layer species is reduced from a top surface of the substrate is reduced. The reduced surface layer species are purged from the process chamber.
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