Invention Grant
- Patent Title: Backlight module and wire mounting assembly therefor
- Patent Title (中): 背光模块和电线安装组件
-
Application No.: US10937190Application Date: 2004-09-09
-
Publication No.: US07232952B2Publication Date: 2007-06-19
- Inventor: Wen-Hsin Lin , Han-Chou Liu , Chang-Ho Shen , Yu-Yan Fu
- Applicant: Wen-Hsin Lin , Han-Chou Liu , Chang-Ho Shen , Yu-Yan Fu
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW93121115A 20040715
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
A backlight module and wire mount assembly used therein. The assembly includes a base and a wire mount. The base includes a surface and a protrusion formed on the surface. A through hole is formed between the protrusion and the surface. The wire mount is disposed on the surface of the base in a manner such that it passes through the through hole. The wire mount serves to fix the wire.
Public/Granted literature
- US20060013006A1 Backlight module and wire mounting assembly therefor Public/Granted day:2006-01-19
Information query
