发明授权
- 专利标题： Method and apparatus for applying particulate material to a substrate
- 专利标题（中）： 将颗粒材料施加到基底的方法和装置
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申请号： US11054842申请日： 2005-02-10
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公开(公告)号： US07235278B2公开(公告)日： 2007-06-26
- 发明人: Paul Y. Fung , Denis Tremblay
- 申请人： Paul Y. Fung , Denis Tremblay
- 申请人地址： US NJ Skillman
- 专利权人： McNeil-PPC, Inc.
- 当前专利权人： McNeil-PPC, Inc.
- 当前专利权人地址： US NJ Skillman
- 主分类号： B05D1/22
- IPC分类号： B05D1/22
摘要：
A method and apparatus of applying a particulate material to a substrate includes applying adhesive to the substrate and passing the substrate through a chamber in which a particulate material is suspended in a fluid in order to adhere the particulate material to the substrate.
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