Invention Grant
- Patent Title: Method and apparatus for applying particulate material to a substrate
- Patent Title (中): 将颗粒材料施加到基底的方法和装置
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Application No.: US11054842Application Date: 2005-02-10
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Publication No.: US07235278B2Publication Date: 2007-06-26
- Inventor: Paul Y. Fung , Denis Tremblay
- Applicant: Paul Y. Fung , Denis Tremblay
- Applicant Address: US NJ Skillman
- Assignee: McNeil-PPC, Inc.
- Current Assignee: McNeil-PPC, Inc.
- Current Assignee Address: US NJ Skillman
- Main IPC: B05D1/22
- IPC: B05D1/22
Abstract:
A method and apparatus of applying a particulate material to a substrate includes applying adhesive to the substrate and passing the substrate through a chamber in which a particulate material is suspended in a fluid in order to adhere the particulate material to the substrate.
Public/Granted literature
- US20050233071A1 Method and apparatus for applying particulate material to a substrate Public/Granted day:2005-10-20
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