Invention Grant
- Patent Title: Chemically and electrically stabilized polymer films
- Patent Title (中): 化学和电化学稳定的聚合物薄膜
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Application No.: US11020422Application Date: 2004-12-21
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Publication No.: US07238626B2Publication Date: 2007-07-03
- Inventor: Chung J. Lee , Atul Kumar
- Applicant: Chung J. Lee , Atul Kumar
- Applicant Address: US CA Fremont
- Assignee: Dielectric Systems, Inc.
- Current Assignee: Dielectric Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Allerman Hall McCoy Russell & Tuttle LLP
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
A method of stabilizing a poly(paraxylylene) dielectric thin film after forming the dielectric thin film via transport polymerization is disclosed, wherein the method includes annealing the dielectric thin film under at least one of a reductive atmosphere and a vacuum at a temperature above a reversible solid phase transition temperature of the dielectric film to convert the film from a lower temperature phase to a higher temperature phase, and cooling the dielectric thin film at a sufficient rate to a temperature below the solid phase transition temperature of the dielectric thin film to trap substantial portions of the film in the higher temperature phase.
Public/Granted literature
- US20050221626A1 Chemically and electrically stabilized polymer films Public/Granted day:2005-10-06
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