Thermal expansion characteristics of test materials of ultra-low thermal expansion material are measured with a test beam that is split into a test material-measuring portion and an instrument-measuring portion. Both measuring portions propagate through common portions of a test arm. The test material-measuring portion encounters a test material, but the instrument-measuring portion does not. Thermal expansion characteristics of the test material are measured to high accuracy by manipulating the measures to distinguish displacements associated with the test material from displacements associated with the instrument structure.