发明授权
- 专利标题： Heat dissipation device
- 专利标题（中）： 散热装置
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申请号： US11164282申请日： 2005-11-17
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公开(公告)号： US07240722B2公开(公告)日： 2007-07-10
- 发明人: Cheng-Tien Lai , Zhi-Yong Zhou , Jiang-Jian Wen
- 申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Jiang-Jian Wen
- 申请人地址： unknown Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人地址： unknown Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 Winston Hsu
- 优先权： CN200510035227 20050608
- 主分类号： F28D15/00
- IPC分类号： F28D15/00 ; F28F7/00
摘要：
A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting with the cold plate to fins (60).
公开/授权文献
- US20060278372A1 HEAT DISSIPATION DEVICE 公开/授权日：2006-12-14
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