Invention Grant
- Patent Title: Micromechanical device and method of manufacture thereof
- Patent Title (中): 微机械装置及其制造方法
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Application No.: US11155771Application Date: 2005-06-20
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Publication No.: US07241638B2Publication Date: 2007-07-10
- Inventor: Hideyuki Funaki
- Applicant: Hideyuki Funaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2001-261999 20010830
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/311
Abstract:
A micromechanical switch comprises a substrate, at least one pair of support members fixed to the substrate, at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate, and a contact portion provided on the moving portion, and a driving electrode placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction parallel to the substrate with electrostatic force so that the contact portions of the beam members which are opposed to each other are short-circuited.
Public/Granted literature
- US20050231794A1 Micromechanical device and method of manufacture thereof Public/Granted day:2005-10-20
Information query
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