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发明授权
US07241641B2 Attachment of integrated circuit structures and other substrates to substrates with vias 有权
将集成电路结构和其他基板连接到具有通孔的基板上

Attachment of integrated circuit structures and other substrates to substrates with vias
摘要：
Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads (139, 350) of the substrate. The vias provide a strong, reliable mechanical and electrical connection. A via may expose not only a contact pad (350) in the substrate but also a surrounding region. Solder (930) wets the contact pad better than the surrounding region, resulting in a stronger solder joint and better electrical conductivity. Alternatively, the contact may include multiple conductive layers (910.1, 910.2), with the top layer (910.2) being more solder wettable than the bottom layer (910.1) and the top layer covering only a portion of the bottom layer.
摘要（中）：

通孔（210,210B）形成在基板的表面。 接触焊盘（139,350）的至少一部分位于通孔中。 集成电路结构的接触焊盘（150,340）被插入到通孔中并附着到衬底的接触焊盘（139,350）上。 通孔提供强大可靠的机械和电气连接。 通孔不仅可以暴露衬底中的接触焊盘（350），而且可以暴露周围区域。 焊料（930）比周围区域润湿接触垫，导致更强的焊点和更好的导电性。 或者，接触可以包括多个导电层（910.1,910.2），顶层（910.2）比底层（910.1）更可焊，并且顶层仅覆盖底层的一部分。

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