发明授权
- 专利标题： Transfer assembly for manufacturing electronic devices
- 专利标题（中）： 用于制造电子设备的传送组件
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申请号： US10846753申请日： 2004-05-13
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公开(公告)号： US07244326B2公开(公告)日： 2007-07-17
- 发明人: Gordon S. W. Craig , Kenneth D. Schatz , Mark A. Hadley , Paul S. Drzaic
- 申请人： Gordon S. W. Craig , Kenneth D. Schatz , Mark A. Hadley , Paul S. Drzaic
- 申请人地址： US CA Morgan Hill
- 专利权人： Alien Technology Corporation
- 当前专利权人： Alien Technology Corporation
- 当前专利权人地址： US CA Morgan Hill
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： B32B37/00
- IPC分类号： B32B37/00
摘要：
A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
公开/授权文献
- US20050000634A1 Transfer assembly for manufacturing electronic devices 公开/授权日：2005-01-06
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