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公开(公告)号：US07931063B2
公开(公告)日：2011-04-26
申请号：US11820603
申请日：2007-06-19
IPC分类号： B32B37/00
CPC分类号： G06K19/07718 , G06K19/07745 , H01L21/673 , H01L21/6835 , H01L23/49855 , H01L23/544 , H01L24/19 , H01L24/76 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2223/54473 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/20 , H01L2224/7665 , H01L2224/81801 , H01L2224/83192 , H01L2224/92144 , H01L2224/95085 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K3/303 , H05K2201/10636 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T156/17 , Y10T156/171 , Y10T156/1744 , Y10T156/1798 , H01L2924/00
摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。
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公开(公告)号：US07244326B2
公开(公告)日：2007-07-17
申请号：US10846753
申请日：2004-05-13
IPC分类号： B32B37/00
CPC分类号： G06K19/07718 , G06K19/07745 , H01L21/673 , H01L21/6835 , H01L23/49855 , H01L23/544 , H01L24/19 , H01L24/76 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2223/54473 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/20 , H01L2224/7665 , H01L2224/81801 , H01L2224/83192 , H01L2224/92144 , H01L2224/95085 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K3/303 , H05K2201/10636 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T156/17 , Y10T156/171 , Y10T156/1744 , Y10T156/1798 , H01L2924/00
摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。
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公开(公告)号：US07253735B2
公开(公告)日：2007-08-07
申请号：US10807775
申请日：2004-03-23
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US20090167534A1
公开(公告)日：2009-07-02
申请号：US12366617
申请日：2009-02-05
IPC分类号： G08B13/22
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US07489248B2
公开(公告)日：2009-02-10
申请号：US11497402
申请日：2006-07-31
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US07868766B2
公开(公告)日：2011-01-11
申请号：US12366617
申请日：2009-02-05
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US06731353B1
公开(公告)日：2004-05-04
申请号：US10144166
申请日：2002-05-10
IPC分类号： G02F1136
CPC分类号： H01L24/95 , H01L21/67144 , H01L21/6838 , H01L23/13 , H01L25/0655 , H01L29/0657 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165
摘要： An apparatus and methods of using the same for transferring functional blocks to a substrate. In one exemplary embodiment, a plurality of functional blocks is deposited in a relocating tool having a first plurality of receptor sites. A transfer tool having a plurality of nozzles in aligning with the first plurality of receptor sites removes the plurality of functional blocks from the relocating tool. The transfer tool then deposits the plurality of functional blocks into a second plurality of receptor sites in a substrate. The receptor sites comprise adhesives for securing the functional blocks. Vibration and water are used to facilitate proper delivery of the functional blocks to the receptor sites.
摘要翻译： 使用该功能块将功能块转移到基板的装置和方法。 在一个示例性实施例中，多个功能块被沉积在具有第一多个受体位点的重定位工具中。 具有与第一多个受体部位对准的多个喷嘴的转移工具从重新定位工具中移除多个功能块。 然后，转移工具将多个功能块沉积到衬底中的第二多个受体位点。 受体部位包括用于固定功能块的粘合剂。 使用振动和水来促进将功能块正确递送到受体位点。
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公开(公告)号：US08350703B2
公开(公告)日：2013-01-08
申请号：US12987995
申请日：2011-01-10
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
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公开(公告)号：US20080156445A1
公开(公告)日：2008-07-03
申请号：US11820603
申请日：2007-06-19
IPC分类号： B32B37/00
CPC分类号： G06K19/07718 , G06K19/07745 , H01L21/673 , H01L21/6835 , H01L23/49855 , H01L23/544 , H01L24/19 , H01L24/76 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2223/54473 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/20 , H01L2224/7665 , H01L2224/81801 , H01L2224/83192 , H01L2224/92144 , H01L2224/95085 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K3/303 , H05K2201/10636 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T156/17 , Y10T156/171 , Y10T156/1744 , Y10T156/1798 , H01L2924/00
摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。
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公开(公告)号：US20110186640A1
公开(公告)日：2011-08-04
申请号：US12987995
申请日：2011-01-10
IPC分类号： G06K19/077
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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