Invention Grant
- Patent Title: Metal alloy elements in micromachined devices
- Patent Title (中): 微加工装置中的金属合金元素
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Application No.: US10015086Application Date: 2001-12-11
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Publication No.: US07244367B2Publication Date: 2007-07-17
- Inventor: Jonathan J. Bernstein , William P. Taylor
- Applicant: Jonathan J. Bernstein , William P. Taylor
- Applicant Address: US CA Milpitas
- Assignee: JDS Uniphase Corporation
- Current Assignee: JDS Uniphase Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B44C1/22 ; C23F1/00

Abstract:
A micromechanical device is provided, which includes at least one flexible member formed from an alloy, where the alloy is made up of one or more noble metals and one or more alloying elements, wherein each of the alloying elements has an equilibrium solid solubility in the noble metal, and wherein the one or more alloying elements are present in an amount that does not result in precipitates. A method for making a micromechanical device includes depositing an alloy on a substrate to form at least one flexible member, the alloy comprising one or more noble metals and one or more alloying elements, wherein the one or more alloying elements form a solid solution with the one or more noble metals; and removing a portion of the substrate or a sacrificial layer beneath the deposited alloy layer to obtain a flexible member.
Public/Granted literature
- US20030116528A1 Metal alloy elements in micromachined devices Public/Granted day:2003-06-26
Information query
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