发明授权
- 专利标题： Lead-frame configuration for chips
- 专利标题（中）： 芯片的引线框配置
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申请号： US10478269申请日： 2002-05-16
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公开(公告)号： US07245005B2公开(公告)日： 2007-07-17
- 发明人: Rainer Moll , Joachim Heinz Schober
- 申请人： Rainer Moll , Joachim Heinz Schober
- 申请人地址： NL Eindhoven
- 专利权人： NXP B.V.
- 当前专利权人： NXP B.V.
- 当前专利权人地址： NL Eindhoven
- 优先权： EP01890149 20010517
- 国际申请： PCT/IB02/01734 WO 20020516
- 国际公布： WO02/095673 WO 20021128
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.
公开/授权文献
- US20040174690A1 Lead-frame configuration for chips 公开/授权日：2004-09-09
信息查询
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