发明授权
US07255153B2 High performance integrated MLC cooling device for high power density ICS and method for manufacturing
有权
高性能集成MLC冷却装置,用于高功率密度ICS和制造方法
- 专利标题: High performance integrated MLC cooling device for high power density ICS and method for manufacturing
- 专利标题(中): 高性能集成MLC冷却装置,用于高功率密度ICS和制造方法
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申请号: US10908758申请日: 2005-05-25
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公开(公告)号: US07255153B2公开(公告)日: 2007-08-14
- 发明人: Daniel G. Berger , Raschid J. Bezama , Lester W. Herron , Bruno Michel , Govindarajan Natarajan
- 申请人: Daniel G. Berger , Raschid J. Bezama , Lester W. Herron , Bruno Michel , Govindarajan Natarajan
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: DeLio & Peterson, LLC
- 代理商 Kelly M. Nowak; Ira D. Blecker
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.
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