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公开(公告)号：US20120325667A1
公开(公告)日：2012-12-27
申请号：US13604666
申请日：2012-09-06
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。
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公开(公告)号：US20120043217A1
公开(公告)日：2012-02-23
申请号：US12806730
申请日：2010-08-19
摘要： An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.
摘要翻译： 一种电镀/蚀刻装置，包括存在于含有用于电镀/蚀刻工艺的电解质的罐的流体射流和干燥器。 流体射流和干燥器从被电镀或蚀刻的部件，例如工作电极上去除多余的液体，例如电解质。 工作电极存在于在电镀或蚀刻操作期间从罐中的第一位置穿过到包含电镀电解质外侧的第二位置的保持器。 当保持器处于第二位置时，流体喷射器冲洗工作电极，并且强制空气干燥器将来自流体射流和电解质的任何剩余流体从工作电极吹入罐中。
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3.发明申请公开(公告)号：US20120043216A1
公开(公告)日：2012-02-23
申请号：US12806719
申请日：2010-08-19
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译： 提供一种电镀设备，其包括用于容纳电镀液的镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。
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4.发明申请公开(公告)号：US20110147922A1
公开(公告)日：2011-06-23
申请号：US12640752
申请日：2009-12-17
申请人： Raschid J. BEZAMA , Timothy H. DAUBENSPECK , Gary LaFONTANT , Ian D. MELVILLE , Ekta MISRA , George J. SCOTT , Krystyna W. SEMKOW , Timothy D. SULLIVAN , Robin A. SUSKO , Thomas A. WASSICK , Xiaojin WEI , Steven L. WRIGHT
发明人： Raschid J. BEZAMA , Timothy H. DAUBENSPECK , Gary LaFONTANT , Ian D. MELVILLE , Ekta MISRA , George J. SCOTT , Krystyna W. SEMKOW , Timothy D. SULLIVAN , Robin A. SUSKO , Thomas A. WASSICK , Xiaojin WEI , Steven L. WRIGHT
IPC分类号： H01L23/498 , H01L21/3205
CPC分类号： H01L23/49816 , H01L21/76804 , H01L23/5226 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05011 , H01L2224/05012 , H01L2224/05013 , H01L2224/05094 , H01L2224/05551 , H01L2224/05552 , H01L2224/05555 , H01L2224/05558 , H01L2224/05559 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/05684 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： Structures and methods to reduce maximum current density in a solder ball are disclosed. A method includes forming a contact pad in a last wiring level and forming a plurality of wires of the contact pad extending from side edges of the contact pad to respective ones of a plurality of vias. Each one of the plurality of wires has substantially the same electrical resistance.
摘要翻译： 公开了减少焊球中的最大电流密度的结构和方法。 一种方法包括在最后的布线层中形成接触焊盘，并且形成从接触焊盘的侧边缘延伸到多个通孔中的多个通孔的接触焊盘的多个导线。 多个导线中的每一根具有基本上相同的电阻。
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公开(公告)号：US20100117209A1
公开(公告)日：2010-05-13
申请号：US11680311
申请日：2007-02-28
申请人： Raschid J. Bezama , Minhua Lu , Lawrence S. Mok
发明人： Raschid J. Bezama , Minhua Lu , Lawrence S. Mok
CPC分类号： H01L23/427 , F28D15/046 , H01L25/065 , H01L25/18 , H01L2224/05001 , H01L2224/05009 , H01L2224/05026 , H01L2224/05568 , H01L2224/0557 , H01L2224/05647 , H01L2224/16145 , H01L2224/16225 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/15311 , H01L2224/05099
摘要： The present invention is directed to a method of packaging multiple semiconductor chips on a second semiconductor chips with a built-in efficient cooling means. One embodiment is to place two multiple chip stacks on opposing sides of a vapor chamber for transferring heat away from the semiconductor chips. Another embodiment is to construct a vapor chamber with a substrate such that at least one multiple chip stack is embedded inside the vapor chamber.
摘要翻译： 本发明涉及一种利用内置高效冷却装置在多个半导体芯片上封装多个半导体芯片的方法。 一个实施例是将两个多个芯片堆放置在蒸气室的相对侧上，以将热量从半导体芯片传送出去。 另一个实施例是构造具有衬底的蒸汽室，使得至少一个多个芯片堆叠被嵌入在蒸气室内。
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公开(公告)号：US07536870B2
公开(公告)日：2009-05-26
申请号：US11308504
申请日：2006-03-30
IPC分类号： F28D5/00
CPC分类号： H01L23/4735 , F28F3/12 , F28F13/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。
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公开(公告)号：US20080179192A1
公开(公告)日：2008-07-31
申请号：US11627494
申请日：2007-01-26
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。
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公开(公告)号：US07111797B2
公开(公告)日：2006-09-26
申请号：US10708736
申请日：2004-03-22
CPC分类号： H01L21/67051 , B08B3/02 , B08B5/02 , B08B15/04 , B08B2203/0229 , H01L21/67028 , Y10S134/902 , Y10T137/2087 , Y10T137/2098
摘要： A fluid particle cleaner and method are disclosed. The invention provides a partition to a side of a fluid nozzle to form: a central cavity configured to define the fluid departing the surface into a central cavity vortex; and a side cavity adjacent the central cavity to define fluid escaping from the central cavity into a side vortex. The vortices interact in a counter-rotating and stationary fashion. The strong and smaller central vortex creates an upward air velocity field that forces any airborne particle to move away from the surface. The side vortex is designed to: connect the central vortex velocity field to the vacuum flow and allow airborne particles to remain suspended until they reach the vacuum flow; and create a decelerating field for high speed particles traveling parallel (horizontally) to the surface to increase the residence time in the central vortex with positive vertical velocity.
摘要翻译： 公开了一种流体颗粒清洁剂和方法。 本发明提供了流体喷嘴侧面的隔板，以形成：中心空腔，其被配置为将离开该表面的流体限定为中心空腔涡流; 以及与中心腔相邻的侧腔，以限定从中心腔逸出到侧涡的流体。 涡流以反向旋转和静止的方式相互作用。 强大和较小的中心涡流产生向上的空气速度场，迫使任何空气中的颗粒远离表面移动。 侧涡被设计成：将中心涡流速度场连接到真空流，并允许空气中的颗粒保持悬浮直到达到真空流; 并产生平行（水平）到表面的高速颗粒的减速场，以增加具有正垂直速度的中心涡流中的停留时间。
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公开(公告)号：US06745932B2
公开(公告)日：2004-06-08
申请号：US10235008
申请日：2002-09-03
IPC分类号： B23K1018
CPC分类号： B23K1/018 , B23K2101/40
摘要： A method and structure for a chip detach apparatus and method that limits the solder ball maximum shear rate and, more particularly, that delays the application of shear force until a minimum predefined temperature is reached. The chip detach apparatus and method can be applied to chips with high solder ball counts, chips with small solder ball sizes, and chips with weak surface strength. The chip detach apparatus and method measures and accounts for variability in the electronic module manufacturing and assembly.
摘要翻译： 用于限制焊球最大剪切速率的切屑分离装置和方法的方法和结构，更具体地说，延迟剪切力的施加直到达到最小预定温度。 芯片分离装置和方法可以应用于具有高焊球计数的芯片，具有小焊球尺寸的芯片和具有弱表面强度的芯片。 芯片分离装置和方法测量并考虑了电子模块制造和组装中的变化。
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10.发明授权Method and apparatus to manufacture an electronic package with direct wiring pattern 失效制造具有直接布线图案的电子封装的方法和装置公开(公告)号：US06459039B1
公开(公告)日：2002-10-01
申请号：US09597906
申请日：2000-06-19
IPC分类号： H05K102
CPC分类号： H01L23/49827 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/113 , H05K3/3436 , H05K2201/09836 , H05K2201/10378 , Y02P70/613 , H01L2224/0401
摘要： An electronic package assembly for electrical interconnection between two electronic modules having differing conductive array parameters is disclosed. The electronic package assembly includes two electronic modules, providing between the two electronic modules an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters. A plurality of conductors traverses a thickness of the interposer of the electronic package assembly, with the conductors including a conductive material optionally coated with a dielectric material, the conductors having a first end at the first conductive arrays and a second end at the second conductive arrays, whereby the conductors connecting the first and second conductive arrays therein are adapted to spatially transform the differing parameters to provide an electrical interconnection. A conductive matrix surrounds the conductors of the interposer of the electronic package assembly. The first set of conductive arrays includes the same conductive array parameters as a first electronic module and the second set of conductive arrays includes the same conductive array parameters as a second electronic module.
摘要翻译： 公开了一种用于具有不同导电阵列参数的两个电子模块之间的电互连的电子封装组件。 电子封装组件包括两个电子模块，在两个电子模块之间提供具有顶表面和底表面的插入件; 具有在顶表面上具有第一导电阵列参数的第一组导电阵列和在底表面上具有第二导电阵列参数的第二组导电阵列，所述第二导电阵列和第一导电阵列具有不同的参数。 多个导体横穿电子封装组件的插入件的厚度，其中导体包括任选涂覆有电介质材料的导电材料，导体在第一导电阵列处具有第一端，在第二导电阵列处具有第二端 由此连接其中的第一和第二导电阵列的导体适于空间转换不同的参数以提供电互连。 导电矩阵围绕电子封装组件的插入件的导体。 第一组导电阵列包括与第一电子模块相同的导电阵列参数，第二组导电阵列包括与第二电子模块相同的导电阵列参数。
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