发明授权
US07256056B2 Method and apparatus for determining the thickness of a dielectric layer 失效
用于确定介电层厚度的方法和装置

  • 专利标题: Method and apparatus for determining the thickness of a dielectric layer
  • 专利标题(中): 用于确定介电层厚度的方法和装置
  • 申请号: US10552950
    申请日: 2004-04-14
  • 公开(公告)号: US07256056B2
    公开(公告)日: 2007-08-14
  • 发明人: Prashant Majhi
  • 申请人: Prashant Majhi
  • 申请人地址: NL Eindhoven
  • 专利权人: NXP B.V.
  • 当前专利权人: NXP B.V.
  • 当前专利权人地址: NL Eindhoven
  • 代理商 Peter Zawilski
  • 优先权: EP03101051 20030417
  • 国际申请: PCT/IB2004/050438 WO 20040414
  • 国际公布: WO2004/092676 WO 20041028
  • 主分类号: H01L21/66
  • IPC分类号: H01L21/66 G01R31/26
Method and apparatus for determining the thickness of a dielectric layer
摘要:
The method for determining the thickness of a dielectric layer according to the invention comprises the step of providing an electrically conductive body (11) having a dielectric layer (13) which is separated from the electrically conductive body (11) by at least a further dielectric layer (3) and a surface (15) of which is exposed. Onto the exposed surface (15) an electric charge is deposited, thereby inducing an electric potential difference between the exposed surface (15) and the electrically conductive body (11). An electrical parameter relating to the electric potential difference is determined and a measurement is performed to obtain additional measurement data relating to the thickness of the dielectric layer (13) and/or to the thickness of the further dielectric layer (3). In this way the thickness of the dielectric layer (13) and/or of the further dielectric layer (3) is determined. The method of manufacturing an electric device (100) comprises this method for determining the thickness of a dielectric layer. The apparatus (10) for determining the thickness of a dielectric layer is arranged to execute this method.
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