发明授权
- 专利标题: Double gate semiconductor device having a metal gate
- 专利标题(中): 具有金属栅极的双栅极半导体器件
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申请号: US10720166申请日: 2003-11-25
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公开(公告)号: US07256455B2公开(公告)日: 2007-08-14
- 发明人: Shibly S. Ahmed , Haihong Wang , Bin Yu
- 申请人: Shibly S. Ahmed , Haihong Wang , Bin Yu
- 申请人地址: US CA Sunnyvale
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: US CA Sunnyvale
- 代理机构: Harrity Snyder LLP
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L29/786 ; H01L29/76
摘要:
A semiconductor device may include a substrate, an insulating layer formed on the substrate and a conductive fin formed on the insulating layer. The conductive fin may include a number of side surfaces and a top surface. The semiconductor device may also include a source region formed on the insulating layer adjacent a first end of the conductive fin and a drain region formed on the insulating layer adjacent a second end of the conductive fin. The semiconductor device may further include a metal gate formed on the insulating layer adjacent the conductive fin in a channel region of the semiconductor device.
公开/授权文献
- US20040110097A1 Double gate semiconductor device having a metal gate 公开/授权日:2004-06-10
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