发明授权
- 专利标题： Liquid jetting head, liquid jetting apparatus, and method of manufacturing the liquid jetting head
- 专利标题（中）： 液体喷射头，液体喷射装置和液体喷射头的制造方法
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申请号： US10967555申请日： 2004-10-18
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公开(公告)号： US07261393B2公开(公告)日： 2007-08-28
- 发明人: Takaaki Miyamoto , Minoru Kohno , Osamu Tateishi
- 申请人： Takaaki Miyamoto , Minoru Kohno , Osamu Tateishi
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sonnenschein Nath & Rosenthal LLP
- 优先权： JPP2003-364395 20031024
- 主分类号： B41J2/05
- IPC分类号： B41J2/05
摘要：
The present invention relates to a liquid jetting head, a liquid jetting apparatus, and a method of manufacturing the liquid jetting head. The invention can be particularly adopted to an ink jet printer of a thermal system. A treatment for building up a coating type insulating material film and a treatment for substantially removing the insulating material film in the forming regions of heating elements by etching are repeated at least a plurality of times, whereby deterioration of the heating elements can be prevented even in the case where generation of steps is prevented by an SOG film.
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