发明授权
- 专利标题: Connection structure of printed wiring board
- 专利标题(中): 印刷线路板的连接结构
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申请号: US10554741申请日: 2004-03-23
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公开(公告)号: US07261569B2公开(公告)日: 2007-08-28
- 发明人: Shinji Uchida , Yoshiyuki Nakai , Tadashi Inoue
- 申请人: Shinji Uchida , Yoshiyuki Nakai , Tadashi Inoue
- 申请人地址: JP Osaka
- 专利权人: J.S.T. Mfg. Co., Ltd.
- 当前专利权人: J.S.T. Mfg. Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Rader, Fishman & Grauer PLLC
- 优先权: JP2003-125678 20030430
- 国际申请: PCT/JP2004/003939 WO 20040323
- 国际公布: WO2004/098248 WO 20041111
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
A connecting structure is for a printed wiring board to be electrically connected to a FPC. The FPC includes a substrate and electro-conductive portions. The printed wiring board includes an insertion opening provided on an edge surface thereof, and line connecting terminals formed on an inner wall face of the insertion opening. A dual in-line contact member including first contact members is fixed to the top end portion of the FPC. Each first contact member includes a main body, and a first arm and a second arm extending from the main body generally in parallel to each other. Furthermore, the first arm and the second arm are bent at bent portions so as to form curves protruding away from each other. With the present embodiment, at least one of the first arm and the second arm press the corresponding line connecting terminal provided within the insertion opening at the bent portion thereof by inserting the FPC to the insertion opening of the printed wiring board. Thus, the FPC is connected to the edge surface of the printed wiring board. This improves the freedom from the perspective of design of the wiring pattern as well as allowing mounting of circuit components with high circuit density.
公开/授权文献
- US20060234521A1 Connection structure of printed wiring board 公开/授权日:2006-10-19
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