Invention Grant
- Patent Title: Pad conditioner for chemical mechanical polishing apparatus
- Patent Title (中): 化学机械抛光装置垫垫调节剂
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Application No.: US11368704Application Date: 2006-03-07
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Publication No.: US07261621B2Publication Date: 2007-08-28
- Inventor: Sung-Taok Moon , Dong-Jun Lee , Jae-Hyun So , Kyoung-Moon Kang , Bong-Su Ahn
- Applicant: Sung-Taok Moon , Dong-Jun Lee , Jae-Hyun So , Kyoung-Moon Kang , Bong-Su Ahn
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2005-0018785 20050307
- Main IPC: B24B19/00
- IPC: B24B19/00 ; B24B21/18
Abstract:
A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.
Public/Granted literature
- US20060199482A1 Pad conditioner for chemical mechanical polishing apparatus Public/Granted day:2006-09-07
Information query
