Pad conditioner for chemical mechanical polishing apparatus
    1.
    发明授权
    Pad conditioner for chemical mechanical polishing apparatus 有权
    化学机械抛光装置垫垫调节剂

    公开(公告)号:US07261621B2

    公开(公告)日:2007-08-28

    申请号:US11368704

    申请日:2006-03-07

    IPC分类号: B24B19/00 B24B21/18

    CPC分类号: B24B53/017 B24D7/14

    摘要: A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the edge portion of the surface and the relatively irregular shaped and friable polishing particles may be provided on the center portion of the surface.

    摘要翻译: 垫调节剂可以包括具有包括具有相对不规则形状和易碎的抛光颗粒的部分的第一区域的表面,以及包括具有相对规则形状和韧性抛光颗粒的部分的第二区域。 可以在表面的边缘部分设置相对规则形状和韧性的抛光颗粒,并且可以在表面的中心部分上设置相对不规则形状且易碎的抛光颗粒。