Invention Grant
US07265300B2 Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
有权
使用具有不同介电常数频率斜率的两种材料的混合基板进行下一次高频改进
- Patent Title: Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
- Patent Title (中): 使用具有不同介电常数频率斜率的两种材料的混合基板进行下一次高频改进
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Application No.: US10800696Application Date: 2004-03-16
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Publication No.: US07265300B2Publication Date: 2007-09-04
- Inventor: Luc Adriaenssens , Amid Hashim , Troy Long
- Applicant: Luc Adriaenssens , Amid Hashim , Troy Long
- Applicant Address: US NV Sparks
- Assignee: Commscope Solutions Properties, LLC
- Current Assignee: Commscope Solutions Properties, LLC
- Current Assignee Address: US NV Sparks
- Agency: McGrath, Geissler, Olds & Richardson, PLLC
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.
Public/Granted literature
- US20040184247A1 Near-end crosstalk compensation at multi-stages Public/Granted day:2004-09-23
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