Abstract:
A connector is provided for compensating crosstalk with respect to an adjacently placed connector. Each of the connectors includes a printed circuit board (PCB), a plurality of pairs of contacts on the PCB, a plurality of pads disposed at edge portions of the PCB for compensating crosstalk, and a plurality of connecting parts for connecting electrically the pads to the pairs of contacts.
Abstract:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.
Abstract:
An insulation displacement contact (IDC) includes: upper and lower ends, each of the upper and lower ends including a slot configured to receive a conductor therein, the slots being generally parallel and non-collinear; and a transitional area merging with the upper and lower ends. An IDC of this configuration can be employed, for example, in 110-style connectors, and can enable such connectors to compensate for differential to common mode crosstalk between adjacent IDC pairs.
Abstract:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.
Abstract:
A connector is provided for compensating crosstalk with respect to an adjacently placed connector. Each of the connectors includes a printed circuit board (PCB), a plurality of pairs of contacts on the PCB, a plurality of pads disposed at edge portions of the PCB for compensating crosstalk, and a plurality of connecting parts for connecting electrically the pads to the pairs of contacts.
Abstract:
Printed wiring boards for communications connectors are provided that include a mounting substrate having at least first through third input terminals and first through third output terminals. A first conductive path connects the first input terminal to the first output terminal, a second conductive path connects the second input terminal to the second output terminal and a third conductive path connects the third input terminal to the third output terminal. A first inductor and a first capacitor are coupled between the first conductive path and the second conductive path, where the first inductor and the first capacitor are arranged in series to provide a first series inductor-capacitor circuit. A second capacitor is coupled between the third conductive path and the second conductive path through the first inductor to provide a second series inductor-capacitor circuit that shares the inductor of the first series inductor-capacitor circuit. Communications connectors that include such wiring boards or equivalent structures are also provided.
Abstract:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.
Abstract:
Communications connectors are disclosed that include a housing having an upper end and a lower end, the upper end of the housing including a plurality of slits that define a plurality of pillars. First and second pairs of tip and ring insulation displacement contacts (IDCs) are mounted in the housing. Each of the IDCs has an upper end that has a first slot, a lower end that has a second slot and an intermediate portion between the upper end and the lower end, the lower end being offset from the upper end. The first slot of each IDC is aligned with a respective one of the slits. The housing further includes through slots that are separated by dividers, where each of the through slots is sized to receive the upper end of a respective one of the IDCs, and each slit of the plurality of slits exposes inner edges of the first slot of a respective one of the IDCs.
Abstract:
A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.
Abstract:
A communications connector includes: a dielectric mounting substrate; a plurality of conductors mounted in the mounting substrate; and a wiring board. Each of the conductors includes a fixed end portion mounted in the mounting substrate and a free end portion, each of the free end portions being positioned in side-by-side and generally parallel relationship, and each of the fixed end portions being positioned in side-by side and generally parallel relationship. The wiring board is positioned between the fixed and free end portions of the conductors, the wiring board being generally perpendicular to the conductors, the wiring board including first and second conductive traces that are electrically insulated from each other. First and second conductors are electrically connected with the first and second traces. The first and second conductive traces are arranged on the wiring board to create a crossover between the first and second conductors.