Invention Grant
- Patent Title: Electronic device including a guest material within a layer and a process for forming the same
- Patent Title (中): 包括层内的客体材料的电子设备及其形成方法
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Application No.: US11026732Application Date: 2004-12-30
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Publication No.: US07268006B2Publication Date: 2007-09-11
- Inventor: Charles Douglas Macpherson , Gordana Srdanov , Matthew Stainer , Gang Yu
- Applicant: Charles Douglas Macpherson , Gordana Srdanov , Matthew Stainer , Gang Yu
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Agent John H. Lamming
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
A process for forming an electronic device includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.
Public/Granted literature
- US20060145167A1 Electronic device including a guest material within a layer and a process for forming the same Public/Granted day:2006-07-06
Information query
IPC分类:
