Invention Grant
- Patent Title: Multi-dimensional compliant thermal cap for an electronic device
- Patent Title (中): 用于电子设备的多维度兼容热盖
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Application No.: US10944979Application Date: 2004-09-20
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Publication No.: US07268292B2Publication Date: 2007-09-11
- Inventor: Mark D. Schultz
- Applicant: Mark D. Schultz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Michael J. Buchenhorner; Casey P. August
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20
Abstract:
A cooling structure for an electronic device comprises a plate including a thermally conducting material disposed over the electronic device. The cooling structure includes a first support and a second support. One of the first support and the second support provides compliance in the x-y directions, and the other support provides compliance in the z direction. In another embodiment of the present invention, the plate comprises a material having high thermal conductivity.
Public/Granted literature
- US20060060367A1 Multi-dimensional compliant thermal cap for an electronic device Public/Granted day:2006-03-23
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