Invention Grant
US07268423B2 Flexible rewiring plate for semiconductor components, and process for producing it
有权
用于半导体元件的柔性重新布线板及其制造方法
- Patent Title: Flexible rewiring plate for semiconductor components, and process for producing it
- Patent Title (中): 用于半导体元件的柔性重新布线板及其制造方法
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Application No.: US11013851Application Date: 2004-12-16
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Publication No.: US07268423B2Publication Date: 2007-09-11
- Inventor: Gottfried Beer , Jochen Dangelmaier , Alfred Haimerl , Manfred Mengel , Klaus Mueller , Klaus Pressel
- Applicant: Gottfried Beer , Jochen Dangelmaier , Alfred Haimerl , Manfred Mengel , Klaus Mueller , Klaus Pressel
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE10359424 20031217
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 μm, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
Public/Granted literature
- US20050142933A1 Flexible rewiring plate for semiconductor components, and process for producing it Public/Granted day:2005-06-30
Information query
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