发明授权
- 专利标题： Semiconductor device, electronic card and pad rearrangement substrate
- 专利标题（中）： 半导体器件，电子卡和衬垫重排衬底
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申请号： US11005387申请日： 2004-12-06
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公开(公告)号： US07268424B2公开(公告)日： 2007-09-11
- 发明人: Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
- 申请人： Minori Kajimoto , Osamu Ikeda , Masaki Momodomi
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Hogan & Hartson LLP
- 优先权： JP2001-342294 20011107
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.