A system and method are provided for scheduling a monitor job for a tool in a semiconductor manufacturing environment and for optimizing the scheduling of jobs in such an environment. In one example, the method includes receiving a monitor job and monitoring a status of the tool to determine when a predefined event occurs. A position in a buffer in which to place the monitor job may be identified in response to the event occurring, where placing the monitor job in the identified position will cause the monitor job to be executed at a correct time.