Invention Grant
US07270199B2 Cutting element with a non-shear stress relieving substrate interface
有权
切割元件具有非剪切应力消除基板界面
- Patent Title: Cutting element with a non-shear stress relieving substrate interface
- Patent Title (中): 切割元件具有非剪切应力消除基板界面
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Application No.: US11162681Application Date: 2005-09-19
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Publication No.: US07270199B2Publication Date: 2007-09-18
- Inventor: David R. Hall , John V. Fernandez
- Applicant: David R. Hall , John V. Fernandez
- Agent Cameron Sneddon; Tyson J Wilde
- Main IPC: E21B10/573
- IPC: E21B10/573

Abstract:
The present invention includes an improved cutting element substrate for cutting elements. The cutting element substrate includes non-planar, non-linear interfaces with an abrasive layer of superhard material affixed thereto often using a high pressure high temperature press apparatus. The cutting element substrate includes a cant intersecting a first and second interfacial surface. A plurality of truncated nodules intersects the first surface and extends towards the second surface. Arcuate segments protrude out of the second surface and are radially positioned along the surface. The truncated nodules are ill-aligned with the arcuate segments proximate the truncated nodules.
Public/Granted literature
- US20070062737A1 A Cutting Element with a Non-shear Stress Relieving Substrate Interface Public/Granted day:2007-03-22
Information query
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