发明授权
US07271093B2 Low-carbon-doped silicon oxide film and damascene structure using same
有权
低碳掺杂氧化硅膜和镶嵌结构使用相同
- 专利标题: Low-carbon-doped silicon oxide film and damascene structure using same
- 专利标题(中): 低碳掺杂氧化硅膜和镶嵌结构使用相同
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申请号: US10852637申请日: 2004-05-24
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公开(公告)号: US07271093B2公开(公告)日: 2007-09-18
- 发明人: Chou San Nelson Loke , Kanako Yoshioka , Kiyoshi Satoh
- 申请人: Chou San Nelson Loke , Kanako Yoshioka , Kiyoshi Satoh
- 申请人地址: JP Tokyo
- 专利权人: ASM Japan K.K.
- 当前专利权人: ASM Japan K.K.
- 当前专利权人地址: JP Tokyo
- 代理机构: Knobbe, Martens, Olson & Bear LLP
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
A method of forming an interconnect for a semiconductor device using triple hard layers, comprises: forming a first hard layer serving as an etch stop layer on a metal interconnect-formed dielectric layer; forming a second hard layer on the first hard layer; forming a dielectric layer on the second hard layer; forming a third hard layer on the dielectric layer; forming a hole through the third and second hard layers, the dielectric layer, and the first hard layer; and filling the hole with metal to establish an interconnect. The second and third hard layers are each made of carbon-doped silicon oxide formed from a source gas and a redox gas, while controlling the carbon content in the second hard layer as a function of a flow rate of the redox gas.