发明授权
- 专利标题： Submount for light emitting device
- 专利标题（中）： 发光装置底座
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申请号： US11372204申请日： 2006-03-10
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公开(公告)号： US07276740B2公开(公告)日： 2007-10-02
- 发明人: Hyung-kun Kim , Su-hee Chae , Tae-hoon Jang
- 申请人： Hyung-kun Kim , Su-hee Chae , Tae-hoon Jang
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Buchanan Ingersoll & Rooney PC
- 优先权： KR10-2005-0038202 20050507
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.
公开/授权文献
- US20060249744A1 Submount for light emitting device 公开/授权日：2006-11-09
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