公开(公告)号：US07276740B2

公开(公告)日：2007-10-02

申请号：US11372204

申请日：2006-03-10

申请人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

发明人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

IPC分类号： H01L33/00

CPC分类号： H01L23/15 ,  H01L23/49811 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/10175

摘要： A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.

摘要翻译： 提供了一种用于发光器件封装的基座。 基座包括基板; 分别形成在所述基板上的第一接合层和第二接合层; 分别形成在第一接合层和第二接合层上的第一阻挡层和第二阻挡层; 分别形成在第一阻挡层和第二阻挡层上的第一焊料和第二焊料; 以及形成在第一阻挡层和第二阻挡层周围的第一阻挡层和第二阻挡层，在倒装芯片工艺期间阻挡熔化的第一焊料和熔化的第二焊料溢出。

公开(公告)号：US20060249745A1

公开(公告)日：2006-11-09

申请号：US11387864

申请日：2006-03-24

申请人： Su-hee Chae ,  Tae-hoon Jang ,  Hyung-kun Kim ,  Youn-joon Sung

发明人： Su-hee Chae ,  Tae-hoon Jang ,  Hyung-kun Kim ,  Youn-joon Sung

IPC分类号： H01L33/00

CPC分类号： H01L33/647 ,  B82Y20/00 ,  H01L33/642 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02492 ,  H01S5/22 ,  H01S5/34333

摘要： A heat dissipating structure is flip-chip bonded to a light-emitting element and facilitates heat dissipation. The heat dissipating structure includes: a submount facing the light-emitting element and having at least one groove; a conductive material layer filled into at least a portion of the at least one groove; and a solder layer interposed between the light-emitting element and the submount for bonding. The heat dissipating structure and the light-emitting device having the same allow efficient dissipation of heat generated in the light-emitting element during operation.

摘要翻译： 散热结构被倒装贴合到发光元件上并且有利于散热。 散热结构包括：面向发光元件并具有至少一个凹槽的基座; 填充到所述至少一个凹槽的至少一部分中的导电材料层; 以及插入在发光元件和用于接合的基座之间的焊料层。 散热结构和具有该散热结构的发光装置允许在操作期间有效地散发在发光元件中产生的热量。

公开(公告)号：US20060138444A1

公开(公告)日：2006-06-29

申请号：US11220696

申请日：2005-09-08

申请人： Won-kyoung Chio ,  Tae-hoon Jang ,  Su-hee Chae ,  Hyung-kun Kim

发明人： Won-kyoung Chio ,  Tae-hoon Jang ,  Su-hee Chae ,  Hyung-kun Kim

IPC分类号： H01L29/24

CPC分类号： H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02256 ,  H01S5/02272 ,  H01S5/02476 ,  H01S5/0425 ,  H01L2924/00014

摘要： A flip-chip bonding structure of a light-emitting element is provided. The structure improves a heat emission efficiency by using a metal column having a high thermal conductivity instead of a solder bump. The structure includes a light-emitting element, a sub-mount, and a metal column. The metal column connects the light-emitting element with the sub-mount electrically and thermally.

摘要翻译： 提供了一种发光元件的倒装键合结构。 该结构通过使用具有高导热性的金属柱而不是焊料凸块来提高散热效率。 该结构包括发光元件，副安装座和金属柱。 金属柱将发光元件与电子和热电子元件连接。

公开(公告)号：US20060249744A1

公开(公告)日：2006-11-09

申请号：US11372204

申请日：2006-03-10

申请人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

发明人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

IPC分类号： H01L33/00

CPC分类号： H01L23/15 ,  H01L23/49811 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/10175

摘要： A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.

摘要翻译： 提供了一种用于发光器件封装的基座。 基座包括基板; 分别形成在所述基板上的第一接合层和第二接合层; 分别形成在第一接合层和第二接合层上的第一阻挡层和第二阻挡层; 分别形成在第一阻挡层和第二阻挡层上的第一焊料和第二焊料; 以及形成在第一阻挡层和第二阻挡层周围的第一阻挡层和第二阻挡层，在倒装芯片工艺期间阻挡熔化的第一焊料和熔化的第二焊料溢出。

公开(公告)号：US07522649B2

公开(公告)日：2009-04-21

申请号：US11808174

申请日：2007-06-07

申请人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

发明人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

IPC分类号： H01S5/00

CPC分类号： H01S5/4031 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/22

摘要： Example embodiments may provide a submount in to which a multi-beam laser diode may be flip-chip bonded and a multi-beam laser diode module including the submount. The submount may include a first submount and a second submount. The first submount may include a first substrate, a plurality of first solder layers formed on the first substrate corresponding to electrodes of the multi-beam laser diode, and a plurality of via holes that may penetrate the first substrate and may be filled with conductive materials to electrically connect to the first solder layers. The electrodes may be bonded to the first solder layers. The second submount may include a second substrate under the first substrate and a plurality of bonding pads corresponding to the number of electrodes formed on the second substrate to electrically connect to the conductive materials filled in the via holes.

摘要翻译： 示例性实施例可以提供一个子基座，多子束激光二极管可以被倒装接合到其上，并且包括该子基座的多光束激光二极管模块。 子安装板可以包括第一子安装座和第二子安装座。 第一基座可以包括第一基板，形成在对应于多光束激光二极管的电极的第一基板上的多个第一焊料层和可以穿透第一基板的多个通孔，并且可以填充导电材料 以电连接到第一焊料层。 电极可以结合到第一焊料层。 第二基座可以包括在第一基板下面的第二基板和对应于形成在第二基板上的电极的数量的多个接合焊盘，以电连接到填充在通孔中的导电材料。

公开(公告)号：US20070286252A1

公开(公告)日：2007-12-13

申请号：US11808174

申请日：2007-06-07

申请人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

发明人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

IPC分类号： H01S5/00

CPC分类号： H01S5/4031 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/22

摘要： Example embodiments may provide a submount in to which a multi-beam laser diode may be flip-chip bonded and a multi-beam laser diode module including the submount. The submount may include a first submount and a second submount. The first submount may include a first substrate, a plurality of first solder layers formed on the first substrate corresponding to electrodes of the multi-beam laser diode, and a plurality of via holes that may penetrate the first substrate and may be filled with conductive materials to electrically connect to the first solder layers. The electrodes may be bonded to the first solder layers. The second submount may include a second substrate under the first substrate and a plurality of bonding pads corresponding to the number of electrodes formed on the second substrate to electrically connect to the conductive materials filled in the via holes.

摘要翻译： 示例性实施例可以提供一个子基座，多子束激光二极管可以被倒装接合到其上，并且包括该子基座的多光束激光二极管模块。 子安装板可以包括第一子安装座和第二子安装座。 第一基座可以包括第一基板，形成在对应于多光束激光二极管的电极的第一基板上的多个第一焊料层和可以穿透第一基板的多个通孔，并且可以填充导电材料 以电连接到第一焊料层。 电极可以结合到第一焊料层。 第二基座可以包括在第一基板下面的第二基板和对应于形成在第二基板上的电极的数量的多个接合焊盘，以电连接到填充在通孔中的导电材料。

公开(公告)号：US07888153B2

公开(公告)日：2011-02-15

申请号：US12805132

申请日：2010-07-14

申请人： Hyun-soo Kim ,  Kyoung-kook Kim ,  Hyung-kun Kim ,  Kwang-ki Choi ,  Jeong-wook Lee

发明人： Hyun-soo Kim ,  Kyoung-kook Kim ,  Hyung-kun Kim ,  Kwang-ki Choi ,  Jeong-wook Lee

IPC分类号： H01L21/00

CPC分类号： H01L33/0079 ,  H01L33/44

摘要： Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

摘要翻译： 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层，有源层和p型半导体层的发射层，形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度，在发射层上形成钝化层，在p型半导体层上形成p型电极 发射层，在钝化层和p型电极上形成金属支撑层，去除衬底，当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分，形成n型 电极，并且切割金属支撑层以将发光层划分为发光器件单元。

公开(公告)号：US20070246712A1

公开(公告)日：2007-10-25

申请号：US11515248

申请日：2006-09-05

申请人： Yu-sik Kim ,  Hyung-kun Kim

发明人： Yu-sik Kim ,  Hyung-kun Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/48235

摘要： A long life light-emitting diode (LED) module is provided. The LED module includes: a light-emitting chip; a phosphor layer formed of phosphor materials that transform light emitted from the light-emitting chip into light having a longer wavelength than the light emitted from the light-emitting chip; a capping layer that is formed on the light-emitting chip and protects the light-emitting chip; and a heat spreading plate that is disposed between the capping layer and the phosphor layer that dissipates heat generated in the light-emitting chip and the phosphor layer.

摘要翻译： 提供长寿命的发光二极管（LED）模块。 LED模块包括：发光芯片; 将从发光芯片发射的光变换为比从发光芯片发射的光更长的波长的荧光材料形成的荧光体层; 覆盖层，形成在所述发光芯片上并保护所述发光芯片; 以及散热板，其设置在所述覆盖层和所述荧光体层之间，其散发在所述发光芯片和所述荧光体层中产生的热量。

公开(公告)号：US20060118800A1

公开(公告)日：2006-06-08

申请号：US11225090

申请日：2005-09-14

申请人： Hyung-kun Kim

发明人： Hyung-kun Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/647 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2224/0401

摘要： A light emitting device package is provided. The light emitting device package includes: a light emitting device; and first and second electrodes disposed a predetermined distance from each other and respectively adhered to the light emitting device so as to be electrically connected to the light emitting device, the first and second electrodes applying a current or voltage to the light emitting device and emitting heat generated by the light emitting device.

摘要翻译： 提供发光器件封装。 发光器件封装包括：发光器件; 以及第一和第二电极彼此间隔预定距离并且分别粘附到发光器件以便电连接到发光器件，第一和第二电极向发光器件施加电流或电压并发射热量 由发光器件产生。

公开(公告)号：US08093615B2

公开(公告)日：2012-01-10

申请号：US11513221

申请日：2006-08-31

申请人： Yu-sik Kim ,  Hyung-kun Kim ,  Cheol-soo Sone ,  Jae-wook Jeong

发明人： Yu-sik Kim ,  Hyung-kun Kim ,  Cheol-soo Sone ,  Jae-wook Jeong

IPC分类号： H01L33/00

CPC分类号： H01L33/50 ,  H01L33/46

摘要： A light emitting diode module having improved luminous efficiency is provided. The light emitting diode module includes: a light emitting chip; a phosphor layer formed of phosphor materials emitting light having a wavelength longer than the light emitted from the light emitting chip using light emitted from the light emitting chip as an excitation source; and a reflection plate that is disposed between the light emitting chip and the phosphor layer and that reflects the light emitted by the phosphor layer.

摘要翻译： 提供了具有改善的发光效率的发光二极管模块。 发光二极管模块包括：发光芯片; 荧光体层，由荧光体材料形成，所述荧光体材料使用从所述发光芯片发射的光作为激发源发射波长比从所述发光芯片发射的光的波长的光; 以及设置在发光芯片和荧光体层之间并且反射由荧光体层发射的光的反射板。