Invention Grant
- Patent Title: Electrical connector with a solder ball locking structure
- Patent Title (中): 具有焊球锁定结构的电连接器
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Application No.: US11003993Application Date: 2004-12-02
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Publication No.: US07278864B2Publication Date: 2007-10-09
- Inventor: Chou Hsuan Tsai
- Applicant: Chou Hsuan Tsai
- Agency: Pro-Techter Int'l Services
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector with a solder ball locking structure includes a base, solder balls and terminals. The base has terminal slots, solder ball slots under the terminal slots, and channels respectively communicating the terminal slots with the solder ball slots. The solder balls are respectively disposed in the solder ball slots. Each ball has a bottom end projecting over a bottom of the base. The terminals are respectively disposed in the terminal slots. Each terminal has a contact extending toward a top of the terminal slot and at least one connecting sheet extending toward a bottom of the terminal slot. The connecting sheet extends to the solder ball slot through the channel and intrudes into the solder ball to form a locking structure, which prevents the solder ball from falling out of the solder ball slot.
Public/Granted literature
- US20060030180A1 Electrical connector with a solder ball locking structure and method for manufacturing the same Public/Granted day:2006-02-09
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