发明授权
- 专利标题: Mounting method and mounting device
- 专利标题(中): 安装方法和安装装置
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申请号: US10511986申请日: 2003-04-22
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公开(公告)号: US07279358B2公开(公告)日: 2007-10-09
- 发明人: Akira Yamauchi , Katsumi Terada , Satoru Naraba , Takashi Hare
- 申请人: Akira Yamauchi , Katsumi Terada , Satoru Naraba , Takashi Hare
- 申请人地址: JP Osaka-shi
- 专利权人: Toray Engineering Co., Ltd.
- 当前专利权人: Toray Engineering Co., Ltd.
- 当前专利权人地址: JP Osaka-shi
- 代理机构: Smith Patent Office
- 优先权: JP2002-125815 20020426
- 国际申请: PCT/JP03/05120 WO 20030422
- 国际公布: WO03/092053 WO 20031106
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.
公开/授权文献
- US20060016555A1 Mounting method and mounting device 公开/授权日:2006-01-26
信息查询
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